Silicon Micromachining
By: Elwenspoek, M.
Contributor(s): Jansen, H.
Material type:
BookPublisher: New York Cambridge University Press 2004ISBN: 978-0-521-60767-1.Subject(s): ElectronicsDDC classification: 621.3815
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BSDU Knowledge Resource Center, Jaipur | Reference | 621.3815 ELW (Browse shelf) | Not For Loan | 017682 |
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| 621.381 LAK Design of Analog Integrated Circuits and Systems | 621.381 LAK Design of Analog Integrated Circuits and Systems | 621.381 SEN Microsystem Design | 621.3815 ELW Silicon Micromachining | 621.382 4 HAY Hand Book on Array Processing and Sensor Networks | 621.392 ARN Verilog Digital Computer Design: Algorithms into hardware | 621.395 ROY Introduction to VLSI Design and Technology |
This comprehensive book provides an overview of the key techniques used in the fabrication of micron-scale structures in silicon. Recent advances in these techniques have made it possible to create a new generation of microsystem devices, such as microsensors, accelerometers, micropumps, and miniature robots. The authors underpin the discussion of each technique with a brief review of the fundamental physical and chemical principles involved. They pay particular attention to methods such as isotropic and anisotropic wet chemical etching, wafer bonding, reactive ion etching, and surface micromachining. There is a special section on bulk micromachining, and the authors also discuss release mechanisms for movable microstructures. The book is a blend of detailed experimental and theoretical material, and will be of great interest to graduate students and researchers in electrical engineering and materials science whose work involves the study of micro-electromechanical systems (MEMS).
Contents:
1. Introduction
2. Anisotropic wet chemical etching
3. Chemical physics of wet chemical etching
4. Wafer bonding
5. Examples and applications
6. Surface micromachining
7. Isotropic wet chemical etching of silicon
8. Introduction into dry etching
9. Why plasmas?
10. Plasma system configurations
11. What is plasma etching?
12. Contact plasma etching
13. Remote plasma etching
14. High aspect ratio trench etching
15. Moulding of microstructures
16. Fabrication of movable microstructures.
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