Digital Integrated Circuits : A Design Perspective
- 2nd
- New Delhi Pearson Education 2016,c2003
- 761
Progressive in content and form, this text successfully bridges the gap between the circuit perspective and system perspective of digital integrated circuit design. Beginning with solid discussions on the operation of electronic devices and in-depth analysis of the nucleus of digital design, the text maintains a consistent, logical flow of subject matter throughout. The revision addresses today's most significant and compelling industry topics, including: the impact of interconnect, design for low power, issues in timing and clocking, design methodologies, and the tremendous effect of design automation on the digital design perspective. The revision reflects the ongoing evolution in digital integrated circuit design, especially with respect to the impact of moving into the deep-ubmicron realm.
Contents Part 1 The Fabrics
Chapter 1 Introduction
Chapter 2 The Manufacturing Process Design Methodology Insert A IC LAYOUT
Chapter 3 The Devices Design Methodology Insert B Circuit Simulation
Chapter 4 The Wire
Part 2 A Circuit Perspective
Chapter 5 The CMOS Inverter
Chapter 6 Designing Combinational Logic Gates in CMOS Design Methodology Insert C How to Simulate Complex Logic Circuits Design Methodology Insert D Layout Techniques for Complex Gates
Chapter 7 Designing Sequential Logic Circuits
Part 3 A System Perspective
Chapter 8 Implementation Strategies for Digital IC Design Methodology Insert E Characterizing Logic and Sequential Cells Design Methodology Insert F Design Synthesis
Chapter 9 Coping with Interconnect
Chapter 10 Timing Issues in Digital Circuits Design Methodology Insert G Design Verification
Chapter 11 Designing Arithmetic Building Blocks
Chapter 12 Designing Memory and Array Structures Design Methodology Insert H Validation and Test of Manufactured Circuits
Problem Solutions
Salient Features NEW - Updating of technology of the deep-submicron realm—The piece makes sure that updates to most of the numeric values with respect to advancing processes can be accomplished easily.
Interconnect material takes a more predominant position and is moved forward in the presentation.
A number of the circuit techniques have been removed or updated or newer approaches have been introduced—Reflects the changes in design approaches over the last decade.
A chapter on manufacturing technology has been introduced—Design methodologies are introduced throughout the text in synchronicity with the circuit content.